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features fully compliant to irda 1.0 physical layer specifications - 9.6 kb/s to 115.2 kb/s operation typical link distance > 1.5 m compatible with hp-sir and tv remote iec825-class 1 eye safe low power operation range - 2.7 v to 5.25 v small module size - 4.0 x 12.2 x 5.1 mm (hxwxd) complete shutdown - txd, rxd, pin diode low shutdown current - 10 na typical adjustable optical power management - adjustable led drive- current to maintain link integrity integrated emi shield - excellent noise immunity edge detection input - prevents the led from long turn-on time interface to various super i/o and controller devices designed to accommodate light loss with cosmetic window only 2 external components are required applications digital imaging - digital still cameras - photo-imaging printers data communication - notebook computers - desktop pcs - win ce handheld products - personal digital assistants (pdas) - printers - fax machines, photocopiers - screen projectors - auto pcs - dongles - set-top box telecommunication products - cellular phones - pagers small industrial & medical instrumentation - general data collection devices - patient & pharmaceutical data collection devices description the HSDL-3610 is a low-profile infrared transceiver module that provides interface between logic and ir signals for through-air, serial, half-duplex ir data link. the module is compliant to irda data physical layer specifications 1.0 and iec825- class 1 eye safe. irda ? data compliant 115.2 kb/s 3 v to 5 v infrared transceiver technical data HSDL-3610#007 HSDL-3610#008 functional block diagram txd (9) md0 (4) md1 (5) gnd (3) gnd (7) agnd (2) v cc (1) r1 v cc sp HSDL-3610 cx1 cx2 leda (10) rxd (8)
2 standard package package option package part number increment front view HSDL-3610#007 400 front view HSDL-3610#017 10 top view HSDL-3610#008 400 top view HSDL-3610#018 10 the HSDL-3610 contains a high- speed and high-efficiency 870 nm led, a silicon pin diode, and an integrated circuit. the ic contains an led driver and a receiver providing a single output (rxd) for all data rates supported. the HSDL-3610 can be completely shut down to achieve very low power consumption. in the shut down mode, the pin diode will be inactive and thus producing very little photo- current even under very bright ambient light. the HSDL-3610 also incorporated the capability for adjustable optical power. with two programming pins; mode 0 and mode 1, the optical power output can be adjusted lower when the nominal desired link distance is one-third or two-third of the full irda link. the HSDL-3610 comes in two package options; the front view option (HSDL-3610#007/#017), and the top view option (hsdl- 3610#008/#018). both options come with integrated shield that helps to ensure low emi emission and high immunity to emi field, thus enhancing reliable performance. application support information the application engineering group is available to assist you with the technical understanding associated with HSDL-3610 infrared transceiver module. you can contact them through your local sales representatives for additional details. ordering information
3 i/o pins configuration table pin description symbol 1 supply voltage vcc 2 analog ground agnd 3 ground gnd 4 mode 0 md0 5 mode 1 md1 6 no connection nc 7 ground gnd 8 receiver data output rxd 9 transmitter data input txd 10 led anode leda transceiver control truth table mode 0 mode 1 rx function tx function 1 0 shutdown shutdown 0 0 sir full distance power 0 1 sir 2/3 distance power 1 1 sir 1/3 distance power x = dont care transceiver i/o truth table transceiver inputs outputs mode txd ei led rxd active 1 x on not valid active 0 high [1] off low [2] active 0 low off high shutdown x [3] low not valid not valid x= dont care ei = in-band infrared intensity at detector notes: 1. in-band el 115.2 kb/s. 2. logic low is a pulsed response. the condition is maintained for duration dependent on the pattern and strength of the incident intensity. 3. to maintain low shutdown current, txd needs to be driven high or low and not left floating. functional block diagram 87654321 9 10 87654321 9 10 back view (HSDL-3610 #007/#017) bottom view (HSDL-3610 #008/#018) txd (9) md0 (4) md1 (5) gnd (3) gnd (7) agnd (2) v cc (1) r1 v cc sp HSDL-3610 cx1 cx2 leda (10) rxd (8)
4 recommended application circuit components component recommended value r1 6.2 w 5%, 0.5 watt, for 2.7 vcc 3.6 v operation 15.0 w 5%, 0.5 watt, for 4.75 vcc 5.25 v operation cx1 [5] 0.47 m f 20%, x7r ceramic cx2 [6] 6.8 m f 20%, tantalum notes : 4. cx1 must be placed within 0.7 cm of the HSDL-3610 to obtain optimum noise immunity. 5. in environments with noisy power supplies, supply rejection performance can be enhanced by including cx2, as shown in HSDL-3610 functional block diagram in page 3. cautions : the bicmos inherent to the design of this component increases the components susceptibility to damage from electrostatic discharge (esd). it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd. iled (a) 0.7 leda voltage (v) 0.3 1.7 2.1 0 0.1 1.3 2.3 0.5 1.5 1.9 0.6 0.4 0.2 iled vs. leda. light output power (lop) vs. iled. marking information the HSDL-3610#007/017 is marked 3610yyww on the shield where yy indicates the units manufacturing year, and ww refers to the work week in which the unit is tested. the HSDL-3610#008/018 has no marking on the shield. lop (mw/sr) 200 iled (ma) 80 120 270 0 20 0 300 160 30 150 180 120 40 100 60 90 180 60 210 240 140
5 absolute maximum ratings [6] parameter symbol minimum maximum unit conditions storage temperature t s -40 +100 c operating temperature t a -20 +70 c dc led current i led (dc) 165 ma peak led current i led (pk) 750 ma 2 m s pulse width, 10% duty cycle led anode voltage v leda -0.5 7 v supply voltage vcc 0 7 v transmitter data i txd (dc) -12 12 ma input current receiver data v o -0.5 vcc+0.5 v |i o (rxd)| = 20 m a output voltage note: 6. for implementations where case to ambient thermal resistance 50 c/w. recommended operating conditions parameter symbol minimum maximum unit conditions operating temperature t a -20 +70 c supply voltage vcc 2.7 5.25 v logic high input voltage for txd, md0, md1, and v ih 2 vcc/3 vcc v fir_sel logic low transmitter v il 0 vcc/3 v input voltage led (logic high) current i leda 180 300 ma pulse amplitude receiver signal rate 2.4 115.2 kb/s ambient light see irda serial infrared physical layer link specification, appendix a for ambient levels
6 electrical & optical specifications specifications hold over the recommended operating conditions unless otherwise noted. unspecified test conditions can be anywhere in their operating range. all typical values are at 25 c and 3.3 v unless otherwise noted. parameter symbol min. typ. max. unit conditions transceiver supply shutdown i cc1 10 200 na v i (txd) v il or current v i (txd) 3 v ih idle i cc2 2.5 5 ma v i (txd) v il , ei = 0 digital input logic i l/h -1 1 m a0 v i v cc current low/high transmitter transmitter logic high ei h 50 120 400 mw/sr v ih = 3.0 v radiant intensity i leda = 200 ma intensity q 1/2 15 peak l p 875 nm wavelength spectral dl 1/2 35 nm line half width viewing angle 2 q 1/2 30 60 optical pulse tpw (ei) 1.5 1.6 1.8 m s tpw(txd) = 1.6 m s at width 115.2 kb/s rise and fall t r (ei), 40 ns tpw(txd) = 1.6 m s at times t f (ei) 115.2 kb/s t r/f (txd) = 10 ns maximum tpw (max) 20 50 m s txd pin stuck high optical pulse width led anode v on (leda) 2.4 v i leda = 200 ma, on state voltage v i (txd) 3 v ih led anode i lk (leda) 1 100 na v leda = v cc = 5.25 v, off state leakage current v i (txd) v il
7 electrical & optical specifications specifications hold over the recommended operating conditions unless otherwise noted. unspecified test conditions can be anywhere in their operating range. all typical values are at 25 c and 3.3 v unless otherwise noted. parameter symbol min. typ. max. unit conditions receiver receiver logic low [8] v ol 0 - 0.4 v i ol = 1.0 ma, data output ei 3 3.6 m w/cm 2 , voltage q 1/2 15 logic high v oh vcc C 0.2 - vcc v i oh = -20 m a, ei 0.3 m w/cm 2 , q 1/2 15 viewing angle 2 q 1/2 30 logic high receiver input ei h 0.0036 500 mw/cm 2 for in-band signals irradiance 115.2 kb/s [7] logic low receiver input ei l 0.3 m w/cm 2 for in-band signals [7] irradiance receiver peak sensitivity l p 880 nm wavelength receiver sir pulse width tpw (sir) 1 4.0 m s q 1/2 15 [9] , c l =10 pf receiver latency time t l 20 50 m s receiver rise/fall times t r/f (rxd) 25 ns receiver wake up time t w 100 m s [10] notes: 7. an in-band optical signal is a pulse/sequence where the peak wavelength, l p, is defined as 850 l p 900 nm, and the pulse characteristics are compliant with the irda serial infrared physical layer link specification. 8. logic low is a pulsed response. the condition is maintained for duration dependent on pattern and strength of the incident intensity. 9. for in-band signals 115.2 kb/s where 3.6 m w/cm 2 ei 500 mw/cm 2 . 10. wake up time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and ready to receive infrared signals. txd stuck on protection t pw (max.) txd led
8 rxd output waveform led optical waveform receiver wake up time definition (when md0 1 1 and md1 1 0) t f v oh 90% 50% 10% v ol t pw t r t f led off 90% 50% 10% led on t pw t r rx light t w rxd valid data
9 HSDL-3610#007 and hsdl3610#017 package outline with dimension and recommended pc board pad layout HSDL-3610#007/#017 (front option) pin 1 mounting center 6.10 4.60 4.00 12.20 3.84 r 1.77 r 2.00 4.05 4.95 10 castellation: pitch 1.1 ?0.1 cumulative 9.90 ?0.1 0.70 0.82 1.68 pin 10 0.45 1.20 0.80 2.55 1.90 +0.50 0 3.24 1.90 5.09 mid of land 1.05 2.40 2.35 2.84 2.08 0.70 0.43 pin 10 pin 1 mounting center top view front view land pattern back view side view all dimensions in millimeters (mm). dimension tolerance is 0.20 mm unless otherwise specified. pin 1 2 3 4 5 v cc agnd gnd md0 md1 pin 6 7 8 9 10 nc gnd rxd txd leda function function 1.15 pin 1 pin 10
10 HSDL-3610#008 and hsdl3610#018 package outline with dimension and recommended pc board pad layout HSDL-3610#008/#018 (top option) pin 1 10 castellation: pitch 1.1 ?0.1 cum. of 9 pitch ?9.9 ?0.1 0.70 pin 10 0.43 bottom view 9.90 2.25 2.40 side view all dimensions in millimeters (mm). dimension tolerance is 0.20 mm unless otherwise specified. 1.50 4.16 12.20 3.83 transmit receive 1.46 2.57 2.08 3.24 2.08 top view 5.00 5.10 0.30 0.30 0.85 5.00 2.50 oc oc mc shield pad 1.70 1.95 1.30 10 x 0.60 pad pin 1 pin 10 pitch 9 x 1.10 0.20 1.60 5.70 2.85 land pad pattern 4.40 0.90 4.89 1.35 r 1.78 r 2.00 front view pin 1 2 3 4 5 v cc agnd gnd md0 md1 pin 6 7 8 9 10 nc gnd rxd txd leda function function legend: mc ?mounting center oc ?optical center
11 tape and reel dimensions (HSDL-3610#007, #017) all dimensions in millimeters (mm) quantity = 400 pieces per reel (HSDL-3610#007) quantity = 10 pieces per tape (HSDL-3610#017) 25.50 + 0.50 - 1.00 178.00 ?2.00 60.00 ?2.00 r 1.00 2.00 ?0.50 1.60 ?0.50 label 5.50 ?0.10 12.40 ?0.10 8.00 ?0.10 4.00 ?0.10 24.00 ?0.20 1.75 ?0.10 1.50 + 0.10 0 0.40 ?0.05 4.20 ?0.10 polarity a v dd empty parts mounted leader empty (400 mm min.) (40 mm min.) direction of pulling tape dimensions (40 mm min.) configuration of tape 13.00 ?0.50 shape and dimensions of reels 2.00 ?0.10 11.50 ?0.10 direction of pulling 21.00 ?0.80
12 tape and reel dimensions (HSDL-3610#008, #018) all dimensions in millimeters (mm) quantity = 400 pieces per reel (HSDL-3610#008) quantity = 10 pieces per tape (HSDL-3610#018) 25.50 + 0.50 - 1.00 178.00 ?2.00 60.00 ?2.00 r 1.00 2.00 ?0.50 1.60 ?0.50 label 4.80 ?0.10 12.80 ?0.10 8.00 ?0.10 4.00 ?0.10 24.00 ?0.20 1.75 ?0.10 1.50 + 0.10 0.40 ?0.05 5.10 ?0.10 polarity v dd empty parts mounted leader empty (400 mm min.) (40 mm min.) direction of pulling tape dimensions (40 mm min.) configuration of tape 13.00 ?0.50 shape and dimensions of reels 2.00 ?0.10 11.50 ?0.10 direction of pulling a 5.30 ?0.10 21.00 ?0.80 5.65 ?0.10
13 moisture proof packaging all HSDL-3610 options are shipped in moisture proof package. once opened, moisture absorption begins. baking conditions if the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. package temperature time in reel 60 c 3 48 hours in bulk 100 c 3 4 hours 125 c 3 2 hours baking should only be done once. units in a sealed moisture-proof package package is opened (unsealed) environment less than 25?, and less than 60% rh? package is opened more than 3 days? perform recommended baking conditions no baking is necessary yes no yes no
14 the reflow profile is a straight- line representation of a nominal temperature profile for a convective reflow solder process. the temperature profile is divided into four process zones, each with different d t/ d time temperature change rates. the d t/ d time rates are detailed in the above table. the temperatures are measured at the component to printed circuit board connections. in process zone p1 , the pc board and HSDL-3610 castellation i/o pins are heated to a temperature of 125 c to activate the flux in the solder paste. the temperature ramp up rate, r1, is limited to 4 c per second to allow for even heating of both the pc board and HSDL-3610 castellation i/o pins. process zone p2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the solder, usually 170 c (338 f). process zone p3 is the solder reflow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 230 c (446 f) for optimum results. the dwell time above the liquidus point of solder should be between 15 and 90 seconds. it usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. beyond a dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. the temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170 c (338 f), to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25 c (77 f) should not exceed -3 c per second maximum. this limitation is necessary to allow the pc board and HSDL-3610 castellation i/o pins to change dimensions evenly, putting minimal stresses on the HSDL-3610 transceiver. reflow profile process zone symbol d t maximum d t/ d time heat up p1, r1 25 c to 125 c4 c/s solder paste dry p2, r2 125 c to 170 c 0.5 c/s p3, r3 170 c to 230 c4 c/s solder reflow (245 c at 10 seconds max.) p3, r4 230 c to 170 c-4 c/s cool down p4, r5 170 c to 25 c-3 c/s 0 t-time (seconds) t ?temperature ?(?) 200 170 125 100 50 50 150 100 200 250 300 150 183 230 p1 heat up p2 solder paste dry p3 solder reflow p4 cool down 25 r1 r2 r3 r4 r5 90 sec. max. above 183? max. 245?
15 appendix a: test method a1. background light and electromagnetic field there are four ambient interference conditions in which the receiver is to operate correctly. the conditions are to be applied separately: 1. electromagnetic field: 3 v/m maximum (please refer to iec 801-3, severity level 3 for details). 2. sunlight: 10 kilolux maximum at the optical port. this is simulated with an ir source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 m w/cm 2 (with no modulation) at the optical port. the light source faces the optical port. this simulates sunlight within the irda spectral range. the effect of longer wavelength radiation is covered by the incandescent condition. 3. incandescent lighting: 1000 lux maximum. this is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 watt to 100 watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. the light sources are above the test area. the source is expected to have a filament temperature in the 2700 to 3050 kelvin range and a spectral peak in the 850 to 1050 nm range. 4. fluorescent lighting: 1000 lux maximum. this is simulated with an ir source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 m w/cm 2 minimum and 0.3 m w/cm 2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. the light sources are above the test area. the frequency of the optical signal is swept over the frequency range from 20 khz to 200 khz. due to the variety of fluorescent lamps and the range of ir emissions, this condition is not expected to cover all circumstances. it will provide a common floor for irda operation. all ir transceivers operating under the recommended drive conditions are classified as cenelec en60825-1 accessible emission limit (ael) class 1. this standard is in effect in europe as of january 1, 1997. ael class 1 led devices are considered eye safe. please see application note 1094 for more information.
16 appendix b: HSDL-3610#007/#017 smt assembly application note 1.0 solder pad, mask and metal solder stencil aperture 1.1 recommended land pattern for HSDL-3610#007/#017 dim. mm inches a 2.40 0.095 b 0.70 0.028 c (pitch) 1.10 0.043 d 2.35 0.093 e 2.80 0.110 f 3.13 0.123 g 4.31 0.170 figure 1.0. stencil and pcba. metal stencil for solder paste printing land pattern pcba stencil aperture solder mask shield solder pad a b f theta 10x pad y d e g rx lens tx lens fiducial x c fiducial figure 2.0. top view of land pattern.
17 1.2 adjacent land keep-out and solder mask areas dim. mm inches h min. 0.2 min. 0.008 j 13.4 0.528 k 4.7 0.185 l 3.2 0.126 adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. h is the minimum solder resist strip width required to avoid solder bridging adjacent pads. it is recommended that 2 fiducial cross be placed at mid- length of the pads for unit alignment. note: wet/liquid photo-imaginable solder resist/mask is recommended. 2.0 recommended solder paste/cream volume for castellation joints based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). figure 3.0. HSDL-3610#007/#017 pcba C adjacent land keep-out and solder mask. h l rx lens tx lens j solder mask land k y
18 allowable misalignment tolerance x C direction 0.2 mm (0.008 inches) theta C direction 2 degrees 2.1 recommended metal solder stencil aperture it is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. this is to ensure adequate printed solder paste volume and no shorting. the following combination of metal stencil aperture and metal stencil thickness should be used: 3.0 pick and place misalignment tolerance and product self-alignment after solder reflow if the printed solder paste volume is adequate, the unit will self- align in the x-direction after solder reflow. units should be properly reflowed in ir hot air convection oven using the recommended reflow profile. the direction of board travel does not matter. see fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.8 0.05 0.110 0.002 0.127 0.005 3.4 0.05 0.134 0.002 w , the width of aperture is fixed at 0.70 mm (0.028 inches) aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions figure 4.0. solder paste stencil aperture. aperture as per land dimensions solder paste l w t (stencil thickness)
19 3.1 tolerance for x-axis alignment of castellation misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. the castellations will completely self- align to the pads during solder reflow as seen in the pictures below. photo 1.0. castellation misaligned to land pads in x-axis before reflow. photo 2.0. castellation self-align to land pads after reflow. 3.2 tolerance for rotational (theta) misalignment units when mounted should not be rotated more than 2 degrees with reference to center x-y as specified in fig 2.0. pictures 3.0 and 4.0 show units before and after reflow. units with a theta misalignment of more than 2 degrees do not completely self align after reflow. units with 2 degree rotational or theta misalignment self-aligned completely after solder reflow. photo 3.0. unit is rotated before reflow. photo 4.0. unit self-aligns after reflow.
20 3.3 y-axis misalignment of castellation in the y-direction, the unit does not self-align after solder reflow . it is recommended that the unit be placed in line with the fiducial mark (mid-length of land pad.) this will enable sufficient land length (minimum of 1 / 2 land length.) to form a good joint. see fig 5.0. 3.4 example of good HSDL-3610#007/#017 castellation solder joints this joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. it should be reflowed in ir hot-air convection reflow oven. direction of board travel does not matter. figure 5.0. section of a castellation in y-axis. photo 5.0. good solder joint. minimum 1/2 the length of the land pad lens edge fiducial y
21 4.0 solder volume evaluation and calculation geometry of an HSDL-3610#007/#017 solder fillet. 0.8 1.2 0.70 0.425 0.20 0.7 0.4
22 appendix c : HSDL-3610#008/#018 smt assembly application note 1.0 solder pad, mask and metal solder stencil aperture 1.1 recommended land pattern for HSDL-3610#008/#018 dim. mm inches a 1.95 0.077 b 0.60 0.024 c (pitch) 1.10 0.043 d 1.60 0.063 e 5.70 0.224 f 3.80 0.150 g 2.40 0.094 h 0.80 0.032 figure 1.0. stencil and pcba. figure 2.0. top view of land pattern. metal stencil for solder paste printing land pattern pcba stencil aperture solder mask shield solder pad a b theta 10x pad y d e g tx lens rx lens fiducial x c fiducial h f
23 1.2 adjacent land keep-out and solder mask areas dim. mm inches h min. 0.2 min. 0.008 j 13.4 0.528 k 5.8 0.228 l 3.5 0.130 adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. h is the minimum solder resist strip width required to avoid solder bridging adjacent pads. it is recommended that 2 fiducial cross be placed at mid- length of the pads for unit alignment. note: wet/liquid photo-imaginable solder resist/mask is recommended. figure 3.0. HSDL-3610#008/#018 pcba C adjacent land keep-out and solder mask. 2.0 recommended solder paste/cream volume for castellation joints based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.28 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). h l tx lens rx lens j solder mask land k y
24 2.1 recommended metal solder stencil aperture it is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. this is to ensure adequate printed solder paste volume and no shorting. the following combination of metal stencil aperture and metal stencil thickness should be used: see fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 3.1 0.05 0.122 0.002 0.127 0.005 3.7 0.05 0.147 0.002 w , the width of aperture is fixed at 0.60 mm (0.024 inches) aperture opening for shield pad is 5.7 mm x 1.6 mm as per land dimensions 3.0 pick and place misalignment tolerance and product self-alignment after solder reflow if the printed solder paste volume is adequate, the unit will self- align in x-direction after solder reflow. units should be properly reflowed in ir hot air convection oven using the recommended reflow profile. the direction of board travel does not matter. allowable misalignment tolerance x C direction 0.2 mm (0.008 inches) figure 4.0. solder paste stencil aperture. aperture as per land dimensions solder paste l w t (stencil thickness)
25 3.1 tolerance for x-axis alignment of castellation misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. the castellations will completely self- align to the pads during solder reflow as seen in the pictures below. 3.2 tolerance for rotational (theta) misalignment units when mounted should not be rotated more than 1 degrees with reference to center x-y as specified in fig 2.0. pictures 3.0 photo 1.0. castellation mis-aligned to land pads in x-axis before reflow. photo 2.0. castellation selfCaligned to land pads after reflow. photo 3.0. unit is rotated before reflow. photo 4.0. unit not self-aligned after reflow. and 4.0 show that unit cannot be self-aligned back due to the small wetting force. units with a theta misalignment of more than 1 degree do not completely self align after reflow. castellation solder
26 3.3 y-axis misalignment of castellation in the y-direction, the unit does not self align after solder reflow. it is recommended that the unit be placed in line with the fiducial mark. this will enable sufficient land length to form a good joint. see fig. 5.0. figure 5.0. section of a castellation in y-axis. 3.4 example of good castellation solder joints this joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. it should be reflowed in ir hot-air convection reflow oven. direction of board travel does not matter. photo 6.0. good attachment before reflow. photo 7.0. good solder joint after reflow. tx lens edge fiducial y rx lens
27 4.0 solder volume evaluation and calculation geometry of an HSDL-3610#008/#018 solder fillet. v solder = (0.8 x 0.6 x 0.1) + (0.5 x 0.6 x 0.46 (0.6 + 1.15)/2) = 0.1662 mm 3 v paste = v solder /0.6 = 0.277 mm 3 0.8 1.15 0.6 0.6 0.1 0.46
www.semiconductor.agilent.com data subject to change. copyright ? 2001 agilent technologies inc. march 13, 2001 obsoletes 5980-1767e (6/00) 5988-2314en

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